100pcs Red Copper Thermal Cooling Pads For Android Phone CPU High Conductivity Copper Sheets, Thickness: 0.5mm
100pcs Red Copper Thermal Cooling Pads For Android Phone CPU High Conductivity Copper Sheets, Thickness: 0.5mm
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No lump sum. No stress. Pick a repayment term that works for your budget — and keep your cash flow intact.
- R103.67/mo 3 months
- R52.42/mo 6 months
- R27.67/mo 12 months
- R From R103.67/month over 3 months, or as low as R27.67/month over 12. Total repayable over 12 months: R332.04. Interest at 20.75% p.a. applies.
- ✓ Quick online application — most people get a decision within minutes. Your first payment only kicks in 30 days after you buy.
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Mobicred is a revolving credit facility provided by Retail Capital (Pty) Ltd, a registered credit provider (NCR reg. NCRCP7852) in terms of the National Credit Act 34 of 2005. Credit is subject to approval and an affordability assessment. Interest rate: 20.75% p.a. compounded monthly (1.7292%/month). Available to South African residents aged 18 and older. Full terms & conditions apply.
Import Taxes & Duties Included
6-13 business days
In Stock CHN
Processing time: 1-3 days
Customs & Import Duties
Tax Responsibilities
Duties and Import Taxes are included (DDP). There will be no extra charges on delivery for this item.
Delivery & Processing
Estimated Delivery Time
6–13 business days
Order Processing
Our daily cut-off is 2:00 PM (SAST).
This item requires 1–3 days processing time before it is dispatched.
Warehouse Origin
Where your item ships from
China: This item is shipped from our international fulfillment center in China and is subject to international transit times.
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Description
100 pieces of red copper thermal cooling pads are designed for heat dissipation in Android smartphone CPUs. They are used after chip reballing or motherboard maintenance to prevent overheating.
- Quantity: 100 pieces
- Material: Oxygen-free pure copper
- Dimensions: 12.4mm x 14mm
- Thickness: 0.5mm
- Compatibility: Suitable for various Android smartphone models
- Function: Provides targeted heat dissipation
- Application: Replaces damaged OEM thermal materials after CPU rework
- Benefit: Reduces risk of device failure due to inadequate cooling
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Current route information
This information is based on the current fulfilment route for this product.
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